CONx HE

Hybrid Electronics Production

The core of our hybrid electronics production tools consists of inkjet printing tools and pick-and-place and micro-assembly tools.

Hybrid electronics combines the benefits of printed electronics, low cost bendable devices, with the computational power of silicon. The core of our hybrid electronics production tools consists of PiXDRO inkjet printing tools for conductive, dielectric and adhesive materials on the one hand and on the other hand pick-and-place and micro-assembly tools. Additional process stations like thermal and photonic curing or laser cutting can easily be added. The equipment runs fully automatic using freely programmable robot tracks in an enclosed environment. The high level of integration and automation ensures both the product yield and quality and the flexibility needed to bring next generation flexible or wearable electronics products to market quickly.

Contact

Sales Meyer Burger (Netherlands) B.V.

+31 (0) 40 2581 581

Events

13.11. - 16.11.2018
SEMICON Europa
Munich, Germany
14.11. - 15.11.2018
Printed Electronics USA
Santa Clara (CA), USA

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