Page

    Results

    68 Products

    Flexible systems for Large Area Plasma Processing

    AK 1000 inline

    Multiple process chambers in a serial layout allow the deposition of complex film stacks in one process stream.

    Flexible systems for Large Area Plasma Processing

    AK 400

    Small process system with linear plasma sources that creates best homogeneity over a large surface with a highly dense plasma

    Flexible systems for Large Area Plasma Processing

    AK 800 / 1000

    The AK 800 and 1000 systems are batch type layouts and differ in maximum sample size and number of plasma sources.

    Automation & Software
    Control systems & software solutions

    Railway Technology

    Intelligent automation solutions for rail transport are needed to meet the goal of transferring transport from road to rail.

    Consumables

    Beams / Adhesives

    Our DMT710 beams were designed specifically for the water-based diamond wire process.

    Technical training

    Operator Training

    Achieve maximum performance from your equipment and yourself

    Brick Master
    Squaring of multi-ingots

    BM 860

    The BM 860 is the latest generation of bricking solutions based on Meyer Burger’s wire saw technology

    Busbar Line
    Cell connection

    Busbar Module Line

    Integrated 3-busbar cell connection solution – expandable to up to 5 busbars with the upgrade option

    Hybrid Electronics Production

    CONx HE

    The core of our hybrid electronics production tools consists of inkjet printing tools and pick-and-place and micro-assembly tools.

    Thin Film Encapsulation

    CONx TFE

    For the encapsulation of sensitive electronics, we develop integrated tools containing FLEx LT and PiXDRO JETx tools.

    Inhouse developed ion sources ranging from 40 mm to 2,000 mm beam dimension

    Cyberis

    Inductively coupled plasma (ICP) sources are the standard sources for most ion beam equipment

    Wafers with the highest surface quality

    DS 261

    The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 one of the leading wire saw.

    High flexibility and precision

    DS 265 DW

    This version of the DS 265 has been developed especially for sapphire applications. It works exclusively with diamond wire.

    Wire saw for hard and brittle materials

    DW 288 Sapphire

    Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals.

    High plasma density and high homogeneity

    ECR Serie

    Patented electron cyclotron resonance (ECR) plasma sources

    Automation & Software
    Production control

    FabEagle DES

    Adapted basic functions of our FabEagle® espcially for R&D useres in laboratories or testing facilities.