Process Support

  • Analyze and optimize production processes
  • Based on specified action plan with clear targets, e.g.:
    • “We increase your Wp per module”
    • “We increase your Cell efficiency”
    • “We reduce your costs through less wire consumption”
  • Experienced application and process engineers as project leaders
  • Metrology process support and Training

Thinner wire in wafering

Reduce the diamond wire thickness from 80 to 70 µm and save 88,000 USD per machine/year.

Contact

Global Service

+41 33 221 28 00