Products from Meyer Burger

Meyer Burger develops groundbreaking system solutions and products for the solar industry (photovoltaic). With a high level of integration, our systems and equipments enable innovative approaches to production processes and pioneering system designs.

Furthermore the company's competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials.

In addition products are developed and produced for specialized cutting technologies, nano surfaces, microwave technologies and inkjet printing.

Contact

Global Sales

+41 33 221 28 00

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    60 Products

    Leading
    CONx TFE
    Thin Film Encapsulation

    CONx TFE

    For the encapsulation of sensitive electronics, we develop integrated tools containing FLEx LT and PiXDRO JETx tools.

    Leading
    DW 291
    Diamond wire saw

    DW 291

    DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry.

    Leading
    DW288 Sapphire
    Wire saw for hard and brittle materials

    DW288 Sapphire

    Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals.

    Leading
    FABiA
    Three deposition processes in a single piece of equipment

    FABiA®

    FABiA® 4.1 now incorporates PERC benefits and proven SiNA® and MAiA® features in a single tool.

    Leading
    HELiA
    Latest generation cell coating

    HELiA

    HELiA is the very latest generation of highly efficient cell coating, known as heterojunction.

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    MAiA
    Equipment for PERC cell coating

    MAiA®

    MAiA® uses high efficiency PERC technology to coat wafers. Newest developments enable upgrades to MAiA® 6.1.

    Leading
    PiXDRO JETx
    Inkjet printer for mass production

    PiXDRO JETx

    PiXDRO JETx for optimum throughput, cost of ownership, product quality and reliability in 24/7 operation.

    Leading
    WIS-06
    Waferinspection system

    WIS-06

    Solution for wafer quality control – the best technology for the most dependable inspection results

    Railway Technology
    Control systems & software solutions

    Railway Technology

    Intelligent automation solutions for rail transport are needed to meet the goal of transferring transport from road to rail.

    Beams / Adhesives
    Consumables

    Beams / Adhesives

    Our DMT710 beams were designed specifically for the water-based diamond wire process.

    Operator Training
    Technical training

    Operator Training

    Achieve maximum performance from your equipment and yourself

    BrickMaster BM 860
    Squaring of multi-ingots

    BM 860

    The BM 860 is the latest generation of bricking solutions based on Meyer Burger’s wire saw technology

    CALiPSO
    In-line oven for a wide range of heat treatments

    CALiPSO

    Thermal processes (annealing, curing) with the lowest possible energy consumption and total flexibility regarding substrate size

    CONx HE
    Hybrid Electronics Production

    CONx HE

    The core of our hybrid electronics production tools consists of inkjet printing tools and pick-and-place and micro-assembly tools.

    DiVA
    Front and rear SiN deposition

    DiVA®

    DiVA® 6.1 integrates SiN deposition processes for both the front and the rear.

    DS 261
    Wafers with the highest surface quality

    DS 261

    The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 one of the leading wire saws.

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