Meyer Burger's Specialized Technologies portfolio has evolved from the technologies which have often been successfully implemented in the PV market and which have evolved to cover a broad range of applications in other markets.
Our high-end equipment is used to cut sapphire crystals into bricks and wafers or to slice ceramics, glass, quartz and a variety of other hard and brittle materials.
Under the award winning PiXDRO brand name, various systems have been developed which enable the scaling of inkjet printing from laboratory applications to the point of mass production. PiXDRO platforms are especially suitable for the manufacture of semiconductor devices, for OLED products (illumination, display, 3D), as well as for printed electronics (PCB).
With the FLEx platform, we offer a thin-film system as part of an integrated solution or as a separate process module which meets the needs of tomorrow’s technologies.
We provide advanced solutions in plasma and ion beam technology for applications in the semiconductor industry, in the production of high precision optics and sensors and many more high-tech markets as well as for research and development.
Innovative, flexible and economic solutions for different branches. Certainly we offer you the appropriate service & support for the complete life cycle of your production worldwide.