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    79 Products

    Leading
    CONx TFE
    Thin Film Encapsulation

    CONx TFE

    For the encapsulation of sensitive electronics, we develop integrated tools containing FLEx LT and PiXDRO JETx tools.

    Leading
    DW 291
    Diamond wire saw

    DW 291

    DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry.

    Leading
    DW288 Sapphire
    Wire saw for hard and brittle materials

    DW288 Sapphire

    Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals.

    Leading
    HELiA
    Latest generation cell coating

    HELiA

    HELiA is the very latest generation of highly efficient cell coating, known as heterojunction.

    Leading
    IonScan 800
    Ultra-precise Film Thickness trimming and Ion Beam Figuring

    IonScan 800

    The IonSys 800 system is designed for industrial ion beam etching and deposition processes with maximum quality and productivity requirements. ...

    Leading
    MAiA
    Equipment for PERC cell coating

    MAiA®

    MAiA® uses high efficiency PERC technology to coat wafers. Newest developments enable upgrades to MAiA® 6.1.

    Leading
    PiXDRO JETx
    Inkjet printer for mass production

    PiXDRO JETx

    PiXDRO JETx for optimum throughput, cost of ownership, product quality and reliability in 24/7 operation.

    Leading
    WIS-06
    Waferinspection system

    WIS-06

    Solution for wafer quality control – the best technology for the most dependable inspection results

    AK 1000 inline
    Flexible systems for Large Area Plasma Processing

    AK 1000 inline

    Multiple process chambers in a serial layout allow the deposition of complex film stacks in one process stream.

    AK 400
    Flexible systems for Large Area Plasma Processing

    AK 400

    Small process system with linear plasma sources that creates best homogeneity over a large surface with a highly dense plasma

    AK 800 / 1000
    Flexible systems for Large Area Plasma Processing

    AK 800 / 1000

    The AK 800 and 1000 systems are batch type layouts and differ in maximum sample size and number of plasma sources.

    Railway Technology
    Control systems & software solutions

    Railway Technology

    Intelligent automation solutions for rail transport are needed to meet the goal of transferring transport from road to rail.

    Beams / Adhesives
    Consumables

    Beams / Adhesives

    Our DMT710 beams were designed specifically for the water-based diamond wire process.

    Operator Training
    Technical training

    Operator Training

    Achieve maximum performance from your equipment and yourself

    BrickMaster BM 860
    Squaring of multi-ingots

    BM 860

    The BM 860 is the latest generation of bricking solutions based on Meyer Burger’s wire saw technology

    CALiPSO
    In-line oven for a wide range of heat treatments

    CALiPSO

    Thermal processes (annealing, curing) with the lowest possible energy consumption and total flexibility regarding substrate size

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