Slicing

For slicing hard and brittle materials, the slurry and diamond wire-technologies are employed. They enable sapphire crystals, ceramics, glass, quartz and other hard materials to be sliced.

Slicing and cutting technologies for hard and brittle materials

Single wire saws / Cropping

Single wire saws are ideally suited for separating workpieces and cutting them to length. They are extremely flexible in use regarding type and dimension of materials. The cutting processes can be precisely tailored to the material. This, in combination with diamond wire, enables to achieve optimum processes.

Multiple wire saws / Wafering

Multiple wire saws enable thin wafers to be produced in large quantities with the maximum possible precision.
The high-efficiency diamond wire saws can be used with ultra-thin wires.

 

Divestment to Precision Surfacing Solutions GmbH & Co. KG

Meyer Burger has sold its photovoltaic and specialized materials wafering equipment and service business to Precision Surfacing Solutions (PSS).

To find out more about wafering, visit Precision Surfacing Solutions GmbH & Co. KG.
Tel: +41 33 224 26 00 info@precision-surface.ch