Single wire saws / Cropping
Single wire saws are ideally suited for separating workpieces and cutting them to length. They are extremely flexible in use regarding type and dimension of materials. The cutting processes can be precisely tailored to the material. This, in combination with diamond wire, enables to achieve optimum processes.
Multiple wire saws / Wafering
Multiple wire saws enable thin wafers to be produced in large quantities with the maximum possible precision.
The high-efficiency diamond wire saws can be used with ultra-thin wires.
Divestment to Precision Surfacing Solutions GmbH & Co. KG
Meyer Burger has sold its photovoltaic and specialized materials wafering equipment and service business to Precision Surfacing Solutions (PSS).