Razor-thin wafers are sliced from mono or multicrystalline ingots by means of diamond wire slicing. The environment-friendly water-based slicing process cuts the silicon ingot twice as fast compared with the slurry process for example.
A monocrystalline ingot is produced using a crystal growing process (Czochralski process). Polycrystalline or multicrystalline ingots are formed by melting existing silicon raw material. Thanks to their purity, monocrystalline wafers have higher efficiencies than multicrystalline wafers.
After the slicing process, the silicon wafers are cleaned and checked using a fully automated inspection system. Any possible microcracks, material or surface defects are identified at this stage and the conductivity measured.
Our equipment for wafer production
Meyer Burger’s measurement technologies for silicon wafers are efficient and deliver reliable results.
The wafer inspection system checks the silicon wafers and sorts them into classes according to quality. It checks the wafers for microcracks, inclusions, saw marks, defective edges, variations in thickness and other parameters.