PiXDRO JETx

Inkjet printer for mass production

PiXDRO JETx for optimum throughput, cost of ownership, product quality and reliability in 24/7 operation.

The PiXDRO JETx inkjet printer for mass production is Meyer Burger’s most advanced platform for printing functional materials. It features a modular architecture and can be configured for a wide range of applications.

The PiXDRO JETx is designed for 24/7 fully automated production, and is typically configured for processing large volumes of customer-specific products.

The PiXDRO JETx system has a granite base for superior stability and extremely high stage accuracy and printing precision, combined with high throughput and lowest cost of ownership. It is based on three standard platforms, the JETx-S, M und P, each system targeting specific application areas and product sizes.

Your benefits:

  • Modular architecture enables fast and reliable application-specific functionality
  • High reliability and productivity
  • Flexible process flow editor
  • Customizable configuration for best cost of ownership and process control
  • Compatible with solvent-based, aqueous, hot melt and UV-curable inks
  • Easy to operate and maintain


Hauptfunktionen und Optionen

  • Mehrfach-Druckkopfanordnungen
  • Mehrere Tintenzufuhr-Systeme
  • Tintenumwälzung für Nanopartikel-Tinten
  • Inline UV-, photonische und NIR-Beschaltung und Härtung
  • Modernste Justiermarken- und Substrat-Ausrichtung
  • Druckkontrollstationen
  • Abströmungskontrolle für ein sauberes Umfeld
  • Integrierte Handschuhbox für inertes Umfeld
  • Automatisches Substrat-Handling
  • Konnektivität mit anderen Prozessanlagen
  • Temperaturgesteuertes Substrat-Haltesystem
  • Mehrspuriges Substrat-Handling
  • MES-Schnittstelle für Fertigungsautomatisierung

Main features and options

  • Multi-printhead arrays
  • Multiple ink supply systems
  • Recirculating ink supply for nano-particle inks
  • In-line UV, photonic and NIR pinning and curing
  • Advanced fiducial and substrate alignment
  • Print inspection stations
  • Downflow control for clean environment
  • Glovebox integration for inert environment
  • Automatic substrate handling
  • Connectivity to other processing equipment
  • Temperature-controlled substrate chuck
  • Multi-lane substrate handling
  • MES interface for factory automation

Options

Service Offers

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