Diamond wire saw
New DW 291 sets industry standards for fastest wafer cutting times. DW 291 delivers a comprehensive set of innovations to further increase wafer output. The patented Diamond Wire Management System (DWMS) ensures a longer service life thanks to resharpening technology and extended winding feature.
Longer web length as well as higher wire speed and acceleration enable an increased throughput per machine and year. Usage of ultra-thin diamond wire is possible as a result of optimized inertia of moving parts, shorter wire path and Diamond Wire Management System (DWMS).
DW 291 is highly resistent to temperature fluctuation and vibrations due to its compact and robust mineral cast frame.
Operation is safer, easier and faster thanks to higher process automation and new intuitive HMI with dialog-based production assistant.
- Increased throughput
- Thin wire capability
- Robustness and durability
- Higher process automation
- Easy and safe operation
Diamond Wire Management System (DWMS)
Diamond Wire Management System (DWMS) – market-proven DWMS provides resharpening technology and extended winding feature. Patented in China (Patent No. CN 1044114334B). DWMS enables faster cutting times, optimized usage of thinner wire and lowest wire breakage time.
Thin wire capability
DW 291 uses 50 µm thin wire, which reduces kerf loss and maximizes the number of wafers per kilogram of silicon. Compact design and improved access to all relevant machine parts allow for better handling of thin wires and boost operator efficiency.