Products from Meyer Burger

Meyer Burger develops groundbreaking system solutions and products for the solar industry (photovoltaic). With a high level of integration, our systems and equipments enable innovative approaches to production processes and pioneering system designs.

Furthermore the company's competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials.

In addition products are developed and produced for specialized cutting technologies, nano surfaces, microwave technologies and inkjet printing.

Contact

Global Sales

+41 33 221 28 00

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    Ergebnisse

    49 Produkte

    Führend
    DW 288 S6
    Diamond wire saw for hard and brittle materials

    DW 288 S6

    The DW 288 S6 multi-wire saw is designed for slicing hard and brittle materials in various industries.

    Führend
    DW 291
    Diamond wire saw

    DW 291

    DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry.

    Führend
    FABiA
    Three deposition processes in a single piece of equipment

    FABiA®

    FABiA® 6.1 now incorporates PERC benefits and proven SiNA® and MAiA® features in a single tool.

    Führend
    HELiA
    Latest generation cell coating

    HELiA

    HELiA is the very latest generation of highly efficient cell coating, known as heterojunction.

    Führend
    Equipment for PERC cell coating

    MAiA®

    MAiA® uses high efficiency PERC technology to coat wafers. Newest developments enable upgrades to MAiA® 6.1.

    Führend
    PiXDRO JETx
    Inkjet printer for mass production

    PiXDRO JETx

    PiXDRO JETx for optimum throughput, cost of ownership, product quality and reliability in 24/7 operation.

    Führend
    PiXDRO JETx SMP
    Inkjet printer for PCB manufacturing

    PiXDRO JETx SMP

    PiXDRO JETx SMP is at the heart of the technology revolution in solder mask application.

    Führend
    WIS-08
    Wafer Inspection System

    WIS-08

    Solution for wafer quality control – the best technology for the most reliable inspection results.

    Advanced Drop Analysis
    Software

    Advanced Drop Analysis

    Automated drop formation research and quality monitoring

    Advanced Gerber File Rasterizer
    Software package

    Advanced Gerber File Rasterizer

    For conversion to inkjet printable format

    Automated Print Optimization
    Optional software module

    Automated Print Optimization

    Software package to quickly define the optimal print settings

    Band wheel overhaul
    for band saws

    Band wheel overhaul

    Essential to ensure a good grip on the band saw

    CALiPSO
    In-line oven for a wide range of heat treatments

    CALiPSO

    Thermal processes (annealing, curing) with the lowest possible energy consumption and total flexibility regarding substrate size

    DiVA
    Front and rear SiN deposition

    DiVA®

    DiVA® 6.1 integrates SiN deposition processes for both the front and the rear.

    DS 261
    Wafers with the highest surface quality

    DS 261

    The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 one of the leading wire saws.

    DW288 Sapphire
    Wire saw for hard and brittle materials

    DW288 Sapphire

    Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals.

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