Photovoltaic Value Chain – Wafer Process
The cost-efficient manufacture of ultra-thin, delicate wafers is achieved by the ongoing refinement of cutting technologies and production processes. Highly efficient wafering systems (automated and integrated) with maximum yield reduce manufacturing costs.
DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry.
With the DW288, the high speed and precision of diamond wire technology are a matter of course.
Solution for wafer quality control – the best technology for the most reliable inspection results.