CDE

Chemical dry etching (CDE) utilizes a chemical reaction between the neutral particles/molecules and the surface of the substrate.

The neutral atoms or molecules are guided into the reaction chamber by means of a plasma and flow across the substrate (e.g. silicon wafers). There they react with the atoms on the surface. Volatile, gaseous reaction products are produced which are exhausted by means of a vacuum pump.

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Sales Meyer Burger (Netherlands) B.V.

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