In contrast to the slurry process, in diamond wire sawing the abrasive grains are fixed to the wire, which explains the alternative term ‘fixed abrasive wafering’ (FAW). Here, the diamond-coated wire is winded over rollers to form a wire web in the same way as for wire sawing using slurry. Processing speed and, in turn, throughput can be greatly increased with the diamond wire process as compared to slurry technology.
Meyer Burger’s diamond wire cutting technology for mono-crystalline silicon is market-leading. The extensive experience in process optimization through maximized cutting speed and minimized wire diameter at highest wafer quality is also beneficial for the process of cutting multi-crystalline silicon. Meyer Burger’s diamond wire cutting technology sets also the industrial standard for the wafering of multi-crystalline silicon.