Ion Beam Deposition

In semiconductor manufacturing and high-precision optics, the demands placed on the surfaces in respect of homogeneity, quality and functionality of the individual layers are constantly increasing. With ion beam deposition, secondary particles are emitted from a sputtering target by means of an ion beam source. These particles are deposited as a thin layer on a substrate using a geometrical arrangement designed for the process.

For this basic process of ion beam deposition (IBD), there are further development stages to meet the different requirements of industry and of research institutes. Other processes are also used for this purpose; they can be summarized under the heading of ion beam assisted deposition (IBAD). One process categorized under IBAD is dual ion beam deposition (DIBD), offered by Meyer Burger in various versions and system concepts.

Alternative processes include magnetron sputtering as a vacuum coating process and RIE etching as a structuring process. A comparison shows that the process rate is generally lower with the ion beam process. The main advantage of the process employed by Meyer Burger, however, lies in the unrivaled definition and reproducibility of its process parameters as well as in outstanding homogeneity and surface properties.

Ion beam equipment from Meyer Burger thus offers a high-end solution for demanding layer deposition and structuring applications not available in the requisite quality with alternative processes. For industry, this applies today to virtually all surface smoothing processes with nm accuracy as well as to the deposition of complex coating systems.


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