Cutting Technologies

The expertise gained over many years in the cutting of hard, brittle and high-value materials combined with experience from the semiconductor industry and photovoltaics, makes Meyer Burger an important supplier in future-oriented markets. The high-end equipment is used among other things for processing sapphire crystals into bricks and wafers or slicing ceramics, glasses, quartzes and a host of other hard and brittle materials. The products sliced with our machines are used as substrates for semiconductors (processors, LEDs), in optical applications as well as in motors (magnets).

Our portfolio extends from systems for laboratory and small scale manufacturing up to machines for very high-volume outputs in 3-shift operation. Our top-class diamond wire and cutting fluids together with our regrooving service ensure your ability to produce at the lowest possible costs.

In addition to our machines, we also offer factory reconditionings and retrofits (for example: TS-23 inner-diameter saw).

Single Wire Slicing / Cropping

Single wire saws are ideally suited for separating and cutting to length of workpieces. They are extremely flexible in use in terms of the type and dimension of materials. The cutting processes can be precisely tailored to the material. This, in combination with diamond wire, enables optimum processes to be achieved.

Multi Wire Slicing / Wafering

Meyer Burger is the market leader in the development and construction of multiple wire saws. The technology enables thin wafers to be produced in large quantities with the maximum possible precision.

The high-efficiency diamond wire saws can be used with ultra-thin wires. They enable our customers to enjoy significant cost savings and competitive advantages.

Contact

Global Sales

+41 33 221 28 00

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