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The MicroSystems business unit provides advanced technology solutions for the coating, structuring and processing of surface areas through the application of plasma and ion beam processes. The company's plant systems are based on a modular architecture that ensures an easy inclusion of a variety of surface modification methods, including Reactive Ion Etching (RIE), Plasma Enhanced Chemical Vapor Deposition (PECVD), Ion Beam Etching (IBE) and Ion Beam Sputter Deposition (IBSD) into existing plant systems.
 
The plant systems are predominantly applied in the semiconductor industry, in the production of high precision optics and sensors as well as for research and development. The MicroSystems' plant systems stand out against their competitors' products in that the plasma and ion beam sources as core components are all developed in-house.

Ion Beam Etching and Deposition to top

Ionsys 500

The IonSys 500 is a compact and reasonably priced ion beam etching tool for processing of up to 150 mm substrates.

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IonSys 800

The IonSys 800 is designed for industrial ion beam etching and deposition processes with maximum quality and productivity requirements.

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Ion Beam Trimming to top

IonScan 800

The IonScan 800 system is designed for industrial ion beam etching and deposition processes with maximum quality and productivity requirements.

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IonScan 3D

The IonScan 3D sets the standard for ion beam figuring (IBF) in high-performance optical component and astronomical mirror manufacturing.

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Plasma Enhanced Deposition and Etching to top

MicroSys 200 / 300

The MicroSys system is designed as a cost effective but high quality solution for research and small scale production applications.


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FLEx R2R PECVD

The FLEx R2R PECVD is a thermal plasma-based PECVD piece of production equipment for the deposition of thin and thick R2R films for various applications like photovoltaics, displa...

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FLEx S2S sALD

The FLEx S2S sALD is suitable for application development that require high speed ALD coating technology combined with excellent uniformity.

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FLEx XL

The FLEx XL is a thermal plasma-based PECVD piece of production equipment for the deposition of thin and thick S2S films for various applications like photovoltaics, display and ba...

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FLEx LT

The FLEx LT is a thermal plasma-based PECVD piece of R&D equipment for the deposition of thin and thick S2S films for various applications like photovoltaics, display and batteries...

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Large Area and Batch Processing to top

AK 400

Small process system with linear plasma sources that create best homogeneity over a large surface thanks to highly dense plasma.

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AK 800 / 1000

The AK 800 and 1000 systems differ in maximum sample size and number of linear plasma sources.

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AK 1000 inline

Multiple process chambers in a serial layout allow the deposition of complex coatings in one process stream.

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