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In the semiconductor industry, silicon is processed into wafers which are then fitted with microelectronic components. Strictest standards apply with regard to waviness (nanotopology) and thickness accuracy. Meyer Burger AG supplies the semiconductor industry with cutting machines.

Cropping & Wafering to top

TS 207 / 10

The inner diameter saw TS 207 / 08 series crops mono-crystalline silicon ingots. During cropping the position of a cut on the ingot may be adjusted to guarantee highest yield.


DS 261

The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 the leading wire saw in the semi-conductor industry.