header-home-mbt 01
Cropping
More...

During the cropping process, the up to 3 metre long ingot is divided into smaller ingot sections. At the same time, defective spots – those with inclusions for example – are identified and excluded from the machining process. Thanks to the precision of our processes, as much as 1.5% more wafers can be cut from an ingot.

bottom
Bricking / Squaring
More...

At the bricking or squaring stage, the round ingot sections are cut into bricks.

bottom
Glueing
More...

The bricks are glued by machine to a special plastic plate (beam). This serves to hold the brick in place during the wafering. Our automated gluing process prevents stresses in the wafers, enabling the wafering process yield to be increased by up to 3%. The beam, glue and wire are constantly refined and optimised in our test centre.

bottom
Wafering
More...

During the wafering, the bricks are cut into extremely thin slices. Meyer Burger is the technology leader in the wire saw area. With the introduction of diamond wire sawing, we double the output of a machine saw and significantly improve wafer quality. At the same time, the costly and time-consuming slurry process is supplanted. The water-based diamond wire process is environment-friendly and reduces surface damage on the wafers.

bottom
Separation, Cleainging & Inspection
More...

After the wafering, the wafers hang individually on the plastic plate (beam). The next step is to remove the glue in a warm water bath. Finally, the wafers are separated from one another by machine and cleaned. In order to reduce the handling times between the process steps and increase the yield, our experts have developed a special wafer carrier, designed with ease of use in mind. At the end of the wafer process, each individual wafer is characterised and sorted. The goal is to be able to take immediate remedial action in the event of quality deviations.

bottom
Process Intelligence
More...

Process Intelligence is the key to an integrated understanding of the whole Production. Even more: it provides the data base for continouse optimization of the processes. improvement of the fab output and efficiency as well as growing yield is the main advantage of this future oriented technology.

bottom

WaferLine: Die integrierte Lösung für Ihren Waferprozess

In der WaferLine verschmelzen sämtliche Schritte der Waferherstellung zu einem fein abgestimmten Gesamtprozess. Um multikristalline Wafer herzustellen, empfiehlt es sich derzeit noch, das bewährte Slurryverfahren anzuwenden, ein Verfahren, das von Meyer Burger massgeblich geprägt wurde. So gehört die Slurryausführung der Drahtsäge DS 271 zu den meistverkauften Maschinen am Markt.


Bricking to top

BM 860

The BrickMaster BM 860 belongs to the newest generation of bricking solutions. Compared to slurry based maschines, the BM 860 doubles the output.

bottom

BS 806/805

The band saws BS 806/805 impress with versatility, precision and simple handling. They are partcularly perfect for multi silicon cutting.

bottom

Cropping to top

TS 207

Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Additional features are easy handling and its robust construction.

bottom

Wafering to top

DS 271/264

Bestsellers for the wafering process. The DS 271/264 are state of the art slurry machines that can be easily upgraded for the diamond wire process.

bottom

Separation, Cleaning & Inspection to top

HE-WU-01

The wet bench unloader picks up the cleaned and dried wafers from the belt system and supplies them one by one to the measuring system. Defective wafers are detected and sorted out...

bottom

WIS-06

The wafer inspection system WIS-06 inspects silicon wafers used in photovoltaic industry and sorts them according to their quality.

bottom

HE-WS-02

According to predefined quality criteria the wafers will automatically be sorted into polystyrene boxes. The HE-WS-02 achieves a speed of one wafer per second.

bottom
print/drucken