During the cropping process, the up to 3 metre long ingot is divided into smaller ingot sections. At the same time, defective spots – those with inclusions for example – are identified and excluded from the machining process. Thanks to the precision of our processes, as much as 1.5% more wafers can be cut from an ingot.
At the bricking or squaring stage, the round ingot sections are cut into bricks.
During the wafering, the bricks are cut into extremely thin slices. Meyer Burger is the technology leader in the wire saw area. With the introduction of diamond wire sawing, we double the output of a machine saw and significantly improve wafer quality. At the same time, the costly and time-consuming slurry process is supplanted. The water-based diamond wire process is environment-friendly and reduces surface damage on the wafers.
After the wafering, the wafers hang individually on the plastic plate (beam). The next step is to remove the glue in a warm water bath. Finally, the wafers are separated from one another by machine and cleaned. In order to reduce the handling times between the process steps and increase the yield, our experts have developed a special wafer carrier, designed with ease of use in mind. At the end of the wafer process, each individual wafer is characterised and sorted. The goal is to be able to take immediate remedial action in the event of quality deviations.
Process Intelligence is the key to an integrated understanding of the whole Production. Even more: it provides the data base for continouse optimization of the processes. improvement of the fab output and efficiency as well as growing yield is the main advantage of this future oriented technology.