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Cropping
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During the cropping process, the up to 3 metre long ingot is divided into smaller ingot sections. At the same time, defective spots – those with inclusions for example – are identified and excluded from the machining process. Thanks to the precision of our processes, as much as 1.5% more wafers can be cut from an ingot.

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Bricking / Squaring
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At the bricking or squaring stage, the round ingot sections are cut into bricks.

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Wafering
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During the wafering, the bricks are cut into extremely thin slices. Meyer Burger is the technology leader in the wire saw area. With the introduction of diamond wire sawing, we double the output of a machine saw and significantly improve wafer quality. At the same time, the costly and time-consuming slurry process is supplanted. The water-based diamond wire process is environment-friendly and reduces surface damage on the wafers.

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Separation, Cleaning & Inspection
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After the wafering, the wafers hang individually on the plastic plate (beam). The next step is to remove the glue in a warm water bath. Finally, the wafers are separated from one another by machine and cleaned. In order to reduce the handling times between the process steps and increase the yield, our experts have developed a special wafer carrier, designed with ease of use in mind. At the end of the wafer process, each individual wafer is characterised and sorted. The goal is to be able to take immediate remedial action in the event of quality deviations.

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Process Intelligence
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Process Intelligence is the key to an integrated understanding of the whole Production. Even more: it provides the data base for continouse optimization of the processes. improvement of the fab output and efficiency as well as growing yield is the main advantage of this future oriented technology.

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WaferLine: The integrated solution for your wafer process

In the WaferLine, all stages in the wafer production process are combined to form a perfectly coordinated overall process. At the heart of the WaferLine is the advanced, environment-friendly diamond wire sawing process which offers the following advantages over the conventional slurry process:

  • Lower wafer unit costs 
  • More wafers per unit of time 
  • Lower process complexity

A further advantage of the diamond wire process lies in the fact that the output can be finished in-house. And of course, Meyer Burger offers individual solutions for this stage, too.


Cropping to top

MB BrickLine

The wafer process begins with the MB BrickLine which consolidates all process steps for the production of ingot or bricks into a fully automated process.

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TS 207

Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Additional features are easy handling and its robust construction.

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Bricking / Squaring to top

MB BrickLine

The wafer process begins with the MB BrickLine which consolidates all process steps for the production of ingot or bricks into a fully automated process.

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Wafering to top

DW 288

The diamond wire saw DW288 Series 3 has been designed for use with extremely fine wires.

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DS 271/264

Bestsellers for the wafering process. The DS 271/264 are state of the art slurry machines that can be easily upgraded for the diamond wire process.

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Separation, Cleaning & Inspection to top

HE-WU-01

The wet bench unloader picks up the cleaned and dried wafers from the belt system and supplies them one by one to the measuring system. Defective wafers are detected and sorted out...

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WIS-06

The wafer inspection system WIS-06 inspects silicon wafers used in photovoltaic industry and sorts them according to their quality.

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HE-WS-02

According to predefined quality criteria the wafers will automatically be sorted into polystyrene boxes. The HE-WS-02 achieves a speed of one wafer per second.

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Consumables to top

Diamond Wire

We manufacture diamond wires in an array of sizes for various applications that demand precision in the cutting of hard and/or brittle materials.

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Beams/Adhesives

Our DMT710 beams were designed specifically for the water-based diamond wire process to optimize your wafering costs and yield.

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