Diamond wire technology is a must for any manufacturer of monocrystalline wafers wanting to achieve the highest wafer quality at the lowest possible costs and the highest possible yield. With its DW 288, Meyer Burger offers the first diamond wire saw that has been developed exclusively for this type of slicing technology. Like no other diamond wire saw, the DW 288 is able to apply the benefits of this technology to the wafer production process.
The diamond wire technology from Meyer Burger achieves a further reduction in cost per wafer. The environmentally friendly water-based sawing process cuts the brick at double the cutting speed compared to the slurry cutting process. This significantly increases production output and maximizes the machine's capacity. The ultra-thin wafers cut with diamond wire are perfectly suited for application in the groundbraking heterojunction (HJT) cell process.
Winner of the Solar Award 2014, the DWMS is an innovative wire winding system which has been specially designed for Meyer Burger diamond wire saws. During cutting, the wire is wound and unwound on spools on each side of the wire web. The innovative DWMS design separates the spool into a supplier storage part and a working part. On the working part, the wire is wound in non-overlapping windings with a minimal pitch. This completely eliminates wire to wire contact, thus extending the life of the wire.