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Boule Cropping
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Efficient slicing technologies with diamond wire

  • Maximum material yield
  • Outstanding surface quality
  • Less grinding work
  • Lowest costs thanks to top-class cutting performance
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Slicing
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Extremely precise, cost-effective and rapid slicing with diamond wire

  • Optimised for diamond wire – maximum wire performance
  • Optimum geometry and surface quality
  • Reduced work in the subsequent process steps
  • High yield and low costs
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Inspection
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The demand for quality control is significant. Based on our know-how in photovoltaic and the semiconductor industry, Meyer Burger already offers customised solutions for these new markets.

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Specialized cutting technologies

The many years of experience in the cutting of hard, brittle and valuable materials, combined with the expertise in the photovoltaic and semiconductor industries, make Meyer Burger an important provider in future-oriented markets. Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals.

Factsheet overview product portfolio


Slicing to top

DS 265 DW

This version of the DS 265 was developed especially for sapphire applications (e.g. LED manufacturing). It works exclusively with diamond wire and has an extremely high output due ...

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DW 288 Sapphire

Our detailed technology and process know-how can be transferred from silicon to ceramics, glass or sapphire crystals. The progressive diamond wire technology here also plays an imp...

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Inspection to top

HE-SIA-02

The fully automated inspection tool for sapphire HB - LED substrates can be integrated in your production line at various positions (after cutting, lapping, or polishing).

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HE-SIM-02

This semi – automated Tool for inspection of Sapphire substrates (and other materials like SiC, GaN, quartz) can be used in your R&D department and for smaller charges of samples r...

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Consumables to top

Diamond Wire

We manufacture diamond wires in an array of sizes for various applications that demand precision in the cutting of hard and/or brittle materials.

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Beams/Adhesives

Our DMT710 beams were designed specifically for the water-based diamond wire process to optimize your wafering costs and yield.

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